CLARK FREEPORT—Listed semiconductor company Phoenix Semiconductor Philippines Corp. said production orders are expected to reach 130 million units of next-generation DDR4 8 and 4-gigabyte dynamic random access modules, flip-chip memory chips and memory cards in the third quarter of 2016.
PSPC said sales revenues were also expected to return to $17 million to 18 million monthly in line with the start of commercial production of the next-generation memory devices in July. PSPC passed stringent production qualification certification from exclusive customer Samsung on July 11.
“The successful migration of PSPC’s commercial-scale production to the next-gen memory technology is a milestone, and is testament to the outstanding manufacturing capability of the Company,” said PSPC president Byeongchun Lee.
PSPC completed the production and delivery of 7.6 million units of the new 8-Gig DDR4 memory devices in July.
The chips are used in servers and high-end desktop PCs. It also produced 2 million units of the 4-Gig DDR4 devices during the month, which are mainly used in the new models of laptops that are now filling the shelves of electronics retailers and establishments around the world.
Trial module production of the 8-Gig DDR4 DRAMs devices was started in April alongside the ramp-up of production systems. In line with the strategic partnership, Samsung provided the DRAM PCB assembly and turned them over to PSPC for module packaging and test. Initial shipments proved successful.
PSPC said it successfully undertook the migration from the 2-D planar NAND technology for Samsung memory cards to the 3-D V-NAND technology. The DDR4 and V-NAND platform represents the current state-of-the-art technology that compresses and stacks higher densities of memory within a vertical architecture.